The 217-36CTRE6 is a Heat Sink made of copper with tin-lead plated finish for improved solderability and assembly. This board level power semiconductor surface mount heat sink features automated production techniques for ease of assembly and a variety of soldering methods, this heat sink allow a greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment. Can be used with water soluble or no clean SMT solder creams or other pastes. It is suitable for use with D2PAK, TO-220, SOT-223 and SOL-20 devices.