6025DG
Boyd Laconia LLCHeat Sink Passive TO-220 Staggered Thru-Hole Copper 17.9°C/W Matte Tin .. see full description
Product Attribute
Attribute Value
Select Attribute
Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
6025DG
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
1200
Device Cooled:
TO-220
Attachment Method:
Screw
Dimension:
22.22 x 6.35 x 31.75mm
Thermal Resistance:
17.9 °C/W
Finish:
Matte Tin
The Boyd Laconia LLC part 6025DG is a high-quality passive heat sink designed for TO-220 components. Made of copper with a matte tin finish, this heat sink offers excellent thermal conductivity and heat dissipation capabilities with a thermal resistance of 17.9°C/W. The staggered thru-hole design ensures easy installation on circuit boards. Ideal for applications requiring efficient cooling solutions in a compact form factor.
Search Keywords:
6025DG
IN STOCK:
0
MOQ for out of Stock Qty:
600
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
5
$4.533
$22.665
100
$4.020
$402.000
250
$3.981
$995.250
600
$3.961
$2,376.600
1,200
$3.873
$4,647.600
1,800
$3.342
$6,015.600
2,400
+
$2.532
$6,076.800
Please Note:
Tariffs may apply for U.S. shipments
Product Guides
English
Chinese
Spanish
