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375424B00034G by boyd laconia llc
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375424B00034G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized

RoHS Compliant
Bulk Packaging
Accessories
Accessories
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
375424B00034G
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3360
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
15.2 x 15.2 x 6.356714mm
Thermal Resistance:
62.56717°C/W
Finish:
Black Anodized6710
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Search Keywords:
375424B00034G
IN STOCK: 0
Minimum Order Quantity:
25
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
25
$1.625
$40.625
250
$1.425
$356.250
500
$1.367
$683.500
1,000
$1.360
$1,360.000
3,360
$1.229
$4,129.440
6,720
$1.184
$7,956.480
10,080
$1.178
$11,874.240
16,800 +
$1.173
$19,706.400
Please Note: Tariffs may apply for U.S. shipments
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