6030B-TTG
Boyd Laconia LLCHeat Sink Passive TO-220 Vertical Thru-Hole Copper 12.5°C/W Tin .. see full description
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Supplier:
Boyd Laconia LLC
Part No:
6030B-TTG
RoHS:
Yes
HTS:
8473305100
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
1000
Package Type:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Solder Tab6706
Dimension:
25.4 x 12.7 x 29.976714mm
Thermal Resistance:
12.56717°C/W
Finish:
Tin6710
The AAVID THERMALLOY 6030B-TTG is a passive heat sink designed to efficiently dissipate heat from TO-220 semiconductor devices. It features a vertical thru-hole mounting configuration, making it easy to install on circuit boards. Made of high-quality copper, this heat sink offers excellent thermal conductivity and corrosion resistance. With a thermal resistance of 12.5°C/W, it effectively keeps the temperature of the TO-220 device low, preventing overheating. The heat sink is coated with a layer of tin for added durability and protection. Whether in industrial or electronic applications, the AAVID THERMALLOY 6030B-TTG ensures optimal thermal management and prolongs the lifespan of the components.
Search Keywords:
6030BTTG
IN STOCK:
0
Minimum Order Quantity:
5
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
5
$4.42
$22.10
50
$3.61
$180.50
100
$3.15
$315.00
250
$3.00
$750.00
500
$2.99
$1,495.00
1,000
$2.55
$2,550.00
3,000
$2.53
$7,590.00
5,000
+
$2.52
$12,600.00
Please Note:
Tariffs may apply for U.S. shipments
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