375424B00034G
Boyd Laconia LLCHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Product Attribute
Attribute Value
Select Attribute
Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
375424B00034G
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
3360
Package Type:
Bulk
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
15.2 x 15.2 x 6.356714mm
Thermal Resistance:
62.56717°C/W
Finish:
Black Anodized6710
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 62.5°C/W Black Anodized
Search Keywords:
375424B00034G
IN STOCK:
0
Minimum Order Quantity:
25
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
25
$1.625
$40.625
250
$1.425
$356.250
500
$1.367
$683.500
1,000
$1.360
$1,360.000
3,360
$1.229
$4,129.440
6,720
$1.184
$7,956.480
10,080
$1.178
$11,874.240
16,800
+
$1.173
$19,706.400
Please Note:
Tariffs may apply for U.S. shipments
Product Guides
CUSTOMERS
ALSO BOUGHT
SKHCBHA010
Switch Tactile N.O. SPST Flat Button PC Pins 0.05A 12VDC 2.55N Thru-Hole
1-1623925-5
CFR100 5% 1K0
399
T-1 3/4 Midget Screw Lamp
KRP-11A-12
Electromechanical Relay 12VAC 10A DPDT (34.04x35.56x58.93)mm Plug-In General Purpose Relay
KRPA-11AG-12
Electromechanical Relay 12VAC 24Ohm 10A DPDT(35.71x35.71x50.8)mm Socket General Purpose Re...
English
Chinese
Spanish
