374724B60024G
Boyd Laconia LLCHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374724B60024G
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
168
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Solder Anchor6706
Dimension:
35 x 35 x 186714mm
Thermal Resistance:
15.36717°C/W
Finish:
Black Anodized6710
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
Search Keywords:
374724B60024G
IN STOCK:
0
Minimum Order Quantity:
5
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
5
$5.365
$26.825
50
$4.629
$231.450
168
$4.552
$764.736
336
$4.529
$1,521.744
504
$4.506
$2,271.024
1,008
$4.484
$4,519.872
2,520
$4.461
$11,241.720
5,040
+
$4.439
$22,372.560
Please Note:
Tariffs may apply for U.S. shipments
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