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374724B60024G by boyd laconia llc
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374724B60024G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized

RoHS Compliant
Packaging
Accessories
Accessories
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
Product Attribute
Attribute Value Select Attribute
Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374724B60024G
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
168
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Solder Anchor6706
Dimension:
35 x 35 x 186714mm
Thermal Resistance:
15.36717°C/W
Finish:
Black Anodized6710
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
Search Keywords:
374724B60024G
IN STOCK: 0
Minimum Order Quantity:
5
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
5
$5.365
$26.825
50
$4.629
$231.450
168
$4.552
$764.736
336
$4.529
$1,521.744
504
$4.506
$2,271.024
1,008
$4.484
$4,519.872
2,520
$4.461
$11,241.720
5,040 +
$4.439
$22,372.560
Please Note: Tariffs may apply for U.S. shipments
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