374624B00032G
Boyd Laconia LLCHeat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374624B00032G
RoHS:
Yes
HTS:
8541900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack
510
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Tape6706
Dimension:
35 x 35 x 106714mm
Thermal Resistance:
23.46717°C/W
Finish:
Black Anodized6710
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4°C/W Black Anodized
Search Keywords:
374624B00032G
IN STOCK:
0
Minimum Order Quantity:
10
Factory Lead-Time
6 Weeks
Price (USD)
Quantity
Unit Price
Ext. Price
10
$5.269
$52.690
50
$4.831
$241.550
250
$4.371
$1,092.750
510
$4.349
$2,217.990
1,020
$4.327
$4,413.540
2,550
$4.305
$10,977.750
5,100
$4.284
$21,848.400
7,650
+
$4.263
$32,611.950
Please Note:
Tariffs may apply for U.S. shipments
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